1.An aluminum heat sink
This is the most common heat sinks, aluminum heat sink as part of the shell to increase heat dissipation area.
2.thermal conductivity plastic case
When the injection molding of plastic shell filled with a thermal conductivity of materials, increasing the thermal conductivity of plastic shell, cooling capacity.
3. surface radiation heat treatment
The surface of the lamp shell radiation heat treatment, the simplest is to apply heat radiation paint, heat radiation way away from the surface of the lamp housing.
4 air hydrodynamics
Light shell shape, to create a convection air, This is the lowest cost way to enhance heat dissipation.
5 fan
Lights inside the shell with the longevity and efficient fan to enhance heat dissipation, low cost, good effect. But want to change the fan is in trouble, do not apply to the outdoors, this design is relatively rare.
6 heat pipe
Use of heat pipe technology, the heat from the LED chip guide to shell cooling fins. The large lamps, street lamps and other common design.
7 liquid bulb
The use of liquid bulb packaging technology, high thermal conductivity of transparent liquid-filled bulb of the lamp body. In addition to the reflective principle, the only use of the LED chip a smooth thermal conductivity, heat technology.
8 of lamp use
Household smaller power LED lights, and often make use of the lamp interior space, heating drive circuit portion or all of the placement. This use of large metal surfaces such as screw caps, lamp heat lamp is a metal electrode of the FN lamp holder and power cord. So part of the heat can be derived heat.
9 thermal conductivity of heat integration - the use of high thermal conductivity ceramic
The purpose of the lamp housing cooling is to reduce the operating temperature of the LED chip, LED chip coefficient of expansion and we used the metal thermal conductivity, thermal material expansion coefficient of the gap can not be soldered directly to the LED chip in order to avoid low-temperature thermal stress damage the LED chip. The latest ceramic material of high thermal conductivity, thermal conductivity close to aluminum, the expansion coefficient can be adjusted to synchronize with the LED chip. This thermal conductivity, heat integration, reducing the thermal conductivity of the intermediate links.